Metal Composite

Depending on the body materials, power inductors are divided into ferrite inductors and metal composite inductors.
The metal composite inductors have a high rated current and are very efficient.

Application

Smart Phones, DC-DC Converters for DSC, DVC, PDA, and Others

Characteristics of Metal Magnet Thin Film Type

Depending on the body materials, power inductors are divided into ferrite inductors and metal composite inductors.
The metal composite inductors have a high rated current and are very efficient.

1. 1. High Efficiency
   • Low Loss Material
2. 2. Low DC Resistance
   • High Aspect Ratio Copper Plating

1. 

   Body Material

2. 

   Shape of Internal Electrodes

Characteristics of Metal Magnet Winding Type

Metal magnet winding-type inductors have high-efficiency and high-current (DC-bias) characteristics due to their optimal body material composition and coil.
These inductors are recognized for their high capacity (4.7 μH).

[Winding-Type Structure]

• Low DC Resistance
• Uniform Packing Technology

  [Body Packing Status Comparison]

Superb Efficiency Characteristics

If the power inductor efficiency is low, battery consumption increases. Efficiency test results show that power inductors are superior to ferrite winding-type inductors in terms of efficiency. Samsung has continuously developed and launched metal magnet power inductors with improved efficiency.

Efficiency

테이블

	0806 HM	0603 UM
Size(mm)	0806(2016)	0603(1608)
Height	1.0mm	1.0mm
Norminal	0.24 uH	0.24 uH
DC Resistance Typ	17mΩ	28mΩ
Rated Current △L=30% Typ	5.3A	3.8A
Rated Current △T=40℃ Typ	4.5A	3.3A
Switching	-	3~9.6MHz
Remark	MP	Sample Available

Winding Type

Winding-type inductors are made by winding coils in “α” shape and the surrounding magnet around them.

1. Chip Body

2. Internal Electrode

3. External Electrode

4. Plating

5. Plating

Thin Film Type

Thin film–type inductors are made by plating coils on substrates and surrounding them with magnets.

1. Chip Body

2. Internal Electrode

3. Insulation Layer

4. Substrate

5. External Electrode

6. Plating

7. Plating