| 1 Low Frequency Decoupling | 2 High Frequency Decoupling |
---|---|---|
Needs | High-Capacitance | Low ESL Low Profile (Ultra-thin) |
MLCCs | 0201 inch ~1㎌ 0402 inch ~2.2㎌ 0603/0805 inch ~22㎌ 1206 inch ~47㎌ 1210 inch ~220㎌ *0402 inch 10㎌ *0805 inch 47㎌ *1206 inch 100㎌ *Under Development | 0201 inch 0.1㎌ 0402 inch Reversed Type *0402/0603 inch 3-Terminal
*Under Development |
Samsungs |
First Solution: Compact High-Capacitance MLCCs
With the development of the ADAS technology, SoC performance is expected to increase by about 10 times, and power consumption at Level 3 is projected to rise more than sixfold. To ensure the stable operation of ADAS SoCs, there is a growing demand for high-capacitance MLCCs and compact-sized MLCCs that can be implemented within limited PCB space.
Size (inch/mm) | Rated Voltage | TCC | Capacitance | Part Number |
---|---|---|---|---|
0805/2012 | 6.3Vdc | X7T | 22㎌ | |
1206/3216 | 6.3Vdc | X7T | 47㎌ |
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Second Solution : Low ESL MLCC will soon be available on Samsung Electro-Mechanics’ Technical Article.